Hong, M. and Li, Q.L. (2007). Reliability experimentations for lead-free solder joint of BGA assemblies. IXth International Workshop on Intelligent Statistical Quality Control, Beijing, September 12-14.

HOME ꄲ Publication_1345630219.bj.wezhan.cn ꄲ Hong, M. and Li, Q.L. (2007). IXth International Workshop on Intelligent Statistical Quality Control, Beijing, September 12-14.

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Hong, M. and Li, Q.L. (2007). Reliability experimentations for lead-free solder joint of BGA assembl

创建时间：2007-09-07 00:00

Hong, M. and Li, Q.L. (2007). IXth International Workshop on Intelligent Statistical Quality Control, Beijing, September 12-14.